2013年10月25日，第18届全国混合集成电路学术会议在浙江省杭州市隆重举行。北京亚科晨旭科技有限公司做为参会企业，在本次会议上做了题为“自动共晶在HIC中的应用”的精彩演讲，获得了与会嘉宾的热烈反响。在本次主题演讲中，亚科电子不仅详细阐述了自动共晶的工艺过程，同时重点介绍了美国高端封装设备供应商PALOMAR的全自动多功能粘片机3800产品，该设备在目前客户大力进行的设备和工艺升级过程中正发挥着越来越重要的作用。

October 25th, 2013. Beijing. The 18th National Hybrid Integrated Circuit Academy Conference is held in Hangzhou, Zhejiang province. As one of the sponsors, AST China has successfully participated in this conference, and gave a speech of 'Applications of Eutectic Automation for HIC'. During the speech, AST China not only introduced eutectic automation technology and processing, but also introduced advanced automatic die bonder equipment -- 3800 die bonder from Palomar Technologies, a global leader by providing die bonders and wire bonding equipments. During the stage of system upgrading period among Chinese customers, 3800 is now playing an important role to fully meet their process requirements.